a.Shanghai Collaborative Innovation Center of High Performance Fibers and Composite (Province-Ministry Joint), Center for Civil Aviation Composites, Donghua University, Shanghai 201620, China
b.State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
c.Shanghai Donghua Composites Technology Co. Ltd., Shanghai 201620, China
d.Key Laboratory of Textile Science & Technology, College of Textiles, Donghua University, Shanghai 201620, China
lyzhang@dhu.edu.cn
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Jia-Qiang Li, Wen-Shuang Li, Wen-Ting Zhang, et al. Enhancing Molecular Chain Entanglement and
Jia-Qiang Li, Wen-Shuang Li, Wen-Ting Zhang, et al. Enhancing Molecular Chain Entanglement and
Thermoplastic polyimides (PIs) with shape memory potential have received growing attention in recent years. In this work, high-performance thermoplastic PIs were fabricated by introducing PIs with chain rigidity (r-PI) into PI with chain flexibility (f-PI). The influences of molecular chain entanglement and ,π,-,π, interactions on their thermomechanical and shape memory properties were investigated. The degree of molecular chain entanglement was quantitively characterized based on dynamic mechanical analysis (DMA). The ,π,-,π, interactions were investigated in detail by X-ray diffraction (XRD) and UV-Vis spectroscopy. It was found that the entanglement density increased and ,π,-,π, interactions became stronger with the introduction of r-PI into f-PI, leading to the improvement of shape recovery. Moreover, a broad and increased glass transition temperature (,T,g,) was achieved, endowing the PIs with multiple shape memory properties. The synergistic effects of increased entanglement density and enhanced ,π,-,π, interactions were beneficial to regulating interchain interactions and thereby achieving high shape memory performance of the PIs.
Shape memory polyimideMolecular chain entanglementπ-π Stacking
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