Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

Yu-Cheng Zi; Gao-Jie Wu; Dong-Xu Pei; Shu Guo; Sheng-Li Qi; Guo-Feng Tian; De-Zhen Wu

doi:10.1007/s10118-023-2941-3

Your Location：

Home >

Browse articles >

Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System

RESEARCH ARTICLE | Updated：2023-05-26

- Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System
- Chinese Journal of Polymer Science Vol. 41, Issue 6, Pages: 956-961(2023)
- Affiliations：
  
  a.Key Laboratory of Carbon Fiber and Functional Polymers (Beijing University of Chemical Technology), Ministry of Education, Beijing 100029, China
  b.Institute of Analysis and Testing, Beijing Academy of Science and Technology (Beijing Center For Physical & Chemical Analysis), Beijing 100089, China
- Author bio：
  
  tiangf@mail.buct.edu.cn
- Funds：
- DOI：10.1007/s10118-023-2941-3
  CLC：
Scan for full text
Yu-Cheng Zi, Gao-Jie Wu, Dong-Xu Pei, et al. Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System. [J]. Chinese Journal of Polymer Science 41(6):956-961(2023)
DOI：

Yu-Cheng Zi, Gao-Jie Wu, Dong-Xu Pei, et al. Decreasing the CTE of Thermoplastic Polyimide by Blending with a Thermosetting System. [J]. Chinese Journal of Polymer Science 41(6):956-961(2023) DOI： 10.1007/s10118-023-2941-3.

摘要

Blending the flexible system BPADA/PDA and the rigid system BPDA/PDA at prepolymer stage. The flexible system ensured the melt processing performance, while the rigid system inhibited the movement of molecular chains and reduce the free volume fraction, thereby reducing the CTE value.

Abstract

A series of thermoplastic polyimide resins with a low coefficient of thermal expansion (CTE) were prepared by blending a rigid resin system 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA)/,p,-phenylenediamine (PDA) with a flexible resin system 4,4'-[isopropylidenebis(,p,-phenyleneoxy)]diphthalic anhydride (BPADA)/PDA. The effects of the blending ratio on the macromolecular coil size, free volume, and CTE of the mixed system were studied. The mixing is carried out in the prepolymer poly(amide acid) (PAA) stage, which makes the two systems more compatible and is conducive to the formation of a semi-interpenetrating network structure between the rigid molecular chains and flexible molecular chains. The flexible structure of the BPADA/PDA system is used to ensure the melt processing performance. The rigid characteristics of the BPDA/PDA system can inhibit the movement of molecular chains and reduce the free volume fraction, thereby reducing the CTE value. When the rigid system content reaches 30%, the CTE can be reduced to 38 ppm/K. This method provides a new approach for studying low CTE thermoplastic polyimide resins.

关键词

Keywords

Coefficient of thermal expansion (CTE)Thermoplastic polyimideMelt processing propertyBlending

references

Imaizumi,S.;Ohtsuki,Y.;Yasuda,T.Printablepolymeractuatorsfromionicliquid,solublepolyimide,andubiquitouscarbonmaterials.ACS Appl. Mater. Interfaces2013,5,6307−6315..

Kim,I.C.;Park,K.W.;TakT.M.Synthesisandcharacterizationofsolublepolyimidesanditsultrafiltrationmembraneperformances.J. Appl. Polym. Sci.1999,73,907−918..

Mittal,K.L.Polyimides:synthesis,characterization,andapplications.Polym. Compos.1982,3,245..

Makino,D.ApplicationofpolyimideresintosemiconductordevicesinJapan.IEEE. Electr. Ins. Mag.1988,4,15−23..

Shukla,P.;Saxena,P.Polymernanocompositesinsensorapplications:areviewonpresenttrendsandfuturescope.Chinese J. Polym. Sci.2021,39,665−691..

Mustafa,C.;Emre,A.Characterizationofcarbonfiber-reinforcedthermoplasticandthermosettingpolyimidematrixcompositesmanufacturedbyusingvarioussynthesizedPIprecursorresins.Compos. Part B-Eng.2022,231,109559..

Xu,J.;Huang,X.;Davim,J.P.;Ji,M.;Chen,M.OnthemachiningbehaviorofcarbonfiberreinforcedpolyimideandPEEKthermoplasticcomposites.Polym. Compos.2020,41,3649−3663..

Ye,W.L.;Wu,W.Z.;Hu,X.;Lin,G.G.3Dprintingofcarbonnanotubesreinforcedthermoplasticpolyimidecompositeswithcontrollablemechanicalandelectricalperformance.Compos. Sci. Technol.2019,182,107671..

Byberg,K.I.;Gebisa,A.W.;Lemu,H.G.MechanicalpropertiesofULTEM9085materialprocessedbyfuseddepositionmodeling.Polym. Test.2018,72,335−347..

Hu,J.;Wang,J.;Qi,S.Thermoplasticandsolubleco-polyimideresinsfabricatedviatheincorporationof2,3,3’,4’-biphenyltetracarboxylicdianhydride.High. Perform. Polym.2019,31,1272−1279..

Yi,L.;Li,C.;Huang,W.Solublepolyimidesfrom4,4’-diaminodiphenyletherwithoneortwotert-butylpedantgroups.Polymer2015,80,67−75..

Kim,S.D.;Lee,S.;Heo,J.Solublepolyimideswithtrifluoromethylpendentgroups.Polymer2013,54,5648−5654..

Sensui,N.;Ishii,J.;Takata,A.Ultra-lowCTEandimprovedtoughnessofPMDA/PDApolyimide-basedmolecularcompositescontainingasymmetricBPDA-typepolyimides.High. Perform. Polym.2009,21,709−728..

Hasegawa,M.;Watanabe,Y.;Tsukuda,S.Solution-processablecolorlesspolyimideswithultralowcoefficientsofthermalexpansionforoptoelectronicapplications.Polym. Int.2016,65,1063−1073..

Yi,J.;Liu,C.;Tian,Y.;Wang,K.;Liu,X.;Luo,L.Improvingdimensionalstabilityathightemperatureandtoughnessofpolyimidefilmsviaadjustableentanglementdensity.Polymer2021,218,123488..

Gao,G.;Mao,D.;Fan,B.;Guan,C.Effectofwetexpansionbehavioronpolyimidemembranediffractivelens.Coatings2019,9,559..

Yin,J.;Mao,D.;Fan,B.Copolyamide-imidemembranewithlowCTEandCMEforpotentialspaceopticalapplications.Polymers2021,13,1001..

Jung,Y.;Yang,Y.;Kim,S.Structuralandcompositionaleffectsonthermalexpansionbehaviorinpolyimidesubstratesofvaryingthicknesses.Eur. Polym. J.2013,49,3642−3650..

Tan,Y.;Zhang,Y.;Jiang,G.Preparationandpropertiesofinherentlyblackpolyimidefilmswithextremelylowcoefficientsofthermalexpansionandpotentialapplicationsforblackflexiblecoppercladlaminates.Polymers2020,12,576..

Yu,X.H.;Liu,J.N.;Wu,D.Y.ColorlessPIstructuredesignandevaluationforachievinglowCTEtarget.Mater. Today Commun.2019,21,100562..

Yang,Z.;Guo,H.;Kang,C.Synthesisandcharacterizationofamide-bridgedcolorlesspolyimidefilmswithlowCTEandhighopticalperformanceforflexibleOLEDdisplays.Polym. Chem.2021,12,5364−5376..

Mushtaq,N.;Wang,Q.;Chen,G.Synthesisofpolyamide-imideswithdifferentmonomersequenceandeffectontransparencyandthermalproperties.Polymer2020,190,122218..

Bai,L.;Zhai,L.;He,M.H.Thermalexpansionbehaviorofpoly(amide-imide)filmswithultrahightensilestrengthandultralowCTE.Chinese J. Polym. Sci.2020,38,748−758..

Tsai,M.H.;Huang,Y.C.;Tseng,I.H.Thermalandmechanicalpropertiesofpolyimide/nano-silicahybridfilms.Thin Solid. Films.2011,519,5238−5242..

Luo,J.;Wu,Y.;Sun,Y.;Wang,G.;Liu,Y.;Zhao,X.;Ding,G.PreparationandcharacterizationofhighthermalconductivityandlowCTEpolyimidecompositereinforcedwithdiamondnanoparticles/SiCwhiskersfor3DICinterposerRDLdielectric.Appl. Sci.2019,9,1962..

Zhou,H.;Lei,H.;Wang,J.Breakingthemutualrestraintbetweenlowpermittivityandlowthermalexpansioninpolyimidefilmsviaabranchedcrosslinkstructure.Polymer2019,162,116−120..

Han,S.;Li,Y.;Hao,F.Ultra-lowdielectricconstantpolyimides:Combinedeffortsoffluorinationandmicro-branchedcrosslinkstructure.Eur. Polym. J.2021,143,110206..

Zhi,X.;Jiang,G.;Zhang,Y.Preparationandpropertiesofcolorlessandtransparentsemi-alicyclicpolyimidefilmswithenhancedhigh-temperaturedimensionalstabilityviaincorporationofalkyl-substitutedbenzanilideunits.J. Appl. Polym. Sci.2022,139,51544..

Peng,W.F.;Lei,H.Y.;Zhang,X.X.Fluorinesubstitutioneffectonthematerialpropertiesintransparentaromaticpolyimides.Chinese J. Polym. Sci.2022,40,781−788..

Lao,H.;Mushtaq,N.;Chen,G.Synthesisandpropertiesoftransparentrandomandmulti-blockpolyamide-imidefilmswithhighmodulusandlowCTE.Eur. Polym. J.2021,153,110512..

Li,X.;Lei,H.;Guo,J.;Wang,J.CompositiondesignandpropertiesinvestigationofBPDA/PDA/TFDBco-polyimidefilmswithlowdielectricpermittivity.J. Appl. Polym. Sci.2019,136,47989..

Hao,F.Y.;Wang,J.H.;Qi,S.L.Structuresandpropertiesofpolyimidewithdifferentpre-imidizationdegrees.Chinese J. Polym. Sci.2020,38,840−846..

Views

Downloads

CSCD

Alert me when the article has been cited

Submit

Tools

Publicity Resources

Improved Mechanical Properties of Poly(butylene succinate) Membrane by Co-electrospinning with Gelatin

Related Author

No data

Related Institution

Key Laboratory of Advanced Materials(Ministry of Education), Department of Chemical Engineering, Tsinghua University

Department of Vascular and Endovascular Surgery, Chinese PLA General Hospital

State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology

Technical Institute of Physics and Chemistry, Chinese Academy of Sciences

National Research Laboratory, Department of Chemical and Biomolecular Engineering(BK-21), Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong

⁰